The Commerce Department amended GlobalFoundries’ existing CHIPS award and reallocated up to $955 million toward silicon photonics, silicon-germanium and advanced packaging. The fresh signal is the target, not merely another subsidy headline: the bottleneck conversation is moving from wafer capacity alone toward the interconnect and packaging layers that determine how useful compute can be assembled. This is an amended award, not a new $955 million on top of the old commitment. NIST/Commerce, Oct. 14
CHIPS money moves from generic capacity to photonics and packaging
The Commerce Department amended GlobalFoundries’ existing CHIPS award and reallocated up to $955 million toward silicon photonics, silicon-germanium and advanced packaging.
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Link to noteOriginally published 15 October 2026. Reporting, forecasts, prices, odds and event availability reflect the original edition.
Sources & further reading
- NIST/Commerce, Oct. 14 nist.gov